Abstract
Glass substrate is suitable for 3D IC applications due to its low dielectric constant, high transparency, and adjustable thermal expansion coefficient. This paper explores a Through Glass Via (TGV) metalization strategy based on the Electro-hydro-dynamics (EHD) printing process. The research involves using nano-silver ink and adjusting the applied voltage. A 0.2mm thick polydimethylsiloxane (PDMS) film is attached to the bottom of a glass, and the top of the glass undergoes oxygen plasma treatment. These steps facilitate the hovering filling process. Furthermore, the study also examines the effects of process parameters particularly applied voltage, on the cone-jet flow rate and direct current resistance. These provide new ideas for filling TGV.
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